... samples) to three hours (six samples). Knut Aasmundtveit can be contacted at: kaa@usn.no 10 10 2017 18 12 2017 © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use rights only Intermetallic compounds Interconnections Assembly Electro...

... Modelling Finite element modelling (FEM) Interconnections Thermal fatigue Fatigue Joint resistance Thermal management 3D IC package Coefficient thermal expansion Through-silicon-vias Finite element methodology Thermal failure Ministry of Science and Technology 104-2221-E-110 -023...

...Dr Agata Skwarek; Damian Nowak; Andrzej Dziedzic; Zbigniew Żaluk; Henryk Roguszczak; Mariusz Węglarski Purpose – The paper aims to investigate on the mechanical properties of surface-mount device (SMD) interconnections made on flexible and rigid substrates. Design/methodology/approach...

... will require a reduction of the flip-chip solder bump pitch to 100 μm or less from the current industrial practice of 130 to150 μm. This work shows that as the packaging size reduced with the solder joint interconnection, the solder size becomes an important factor in the intermetallic composition as well...

... miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important...

...Dr Agata Skwarek; Rainer Dudek; Peter Sommer; Andreas Fix; Joerg Trodler; Sven Rzepka; Bernd Michel Purpose – Because of the need for electronics use at temperatures beyond 150°C, high temperature resistant interconnection technologies like transient liquid phase (TLP) soldering and silver...