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Keywords: Joint interface
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Journal Articles
Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 93–101.
Published: 02 April 2019
... with the addition of lanthanides (Ce, Ga). Soldering was performed at a temperature of 280°C. A reaction layer formed of Ti oxides occurred on the solder/substrate interface. The shear strength of joints was 24 MPa. Shear strength AlN ceramics Joint interface Phase composition Sn-Ag-Ti solder...
