...Xinmeng Zhai; Yue Chen; Yuefeng Li; Jun Zou; Mingming Shi; Bobo Yang Purpose This study aims to study the mechanical, photoelectric, and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip light-emitting diode (LED) package component during aging. By adding...

...Barbara Dziurdzia; Maciej Sobolewski; Janusz Mikołajek; Sebastian Wroński Purpose This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free...

... soldering processes are developed and presented. Major paste properties such as printability are compared to a commercial flux solder paste. High-power flip chip LEDs which can be assembled directly on a printed circuit board are used to demonstrate the fluxless soldering. Likewise, the soldering results...

...Barbara Dziurdzia; Janusz Mikolajek Purpose The purpose of this paper is to evaluate selected methods of reduction voidings in lead-free solder joints underneath thermal pads of light-emitting diodes (LEDs), using X-ray inspection and Six Sigma methodology. Design/methodology/approach...