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Keywords: Low-pressure
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (3): 129–136.
Published: 21 January 2020
.... Finally, bonding stress evolution was characterized by shear tests. Findings Low-pressure-assisted large-area double-layer-printed bonding process consisting of six-step was successfully developed to bond DBA substrates with the size of 50.8 × 25.4 mm. The thickness of the sintered-silver bond-line...
