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Keywords: Mechanical properties Sn58Bi solder
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Journal Articles
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (2): 97–107.
Published: 15 February 2024
... 2023 10 11 2023 22 11 2023 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Interfacial IMC Microstructure Mechanical properties Sn58Bi solder Si3N4 nanoparticles With the end of Moore's Law and the shrinking size of chips...
