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Keywords: Melting
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (1): 4–10.
Published: 09 February 2010
...J. Mittal; K.L. Lin Purpose The purpose of this paper is to visualise the activities of three solders; Sn‐37Pb, Sn‐9Zn and Sn‐3.5Ag on Cu substrates during reflow near their melting points and to relate them with reflow reactions between solder and substrate. Design/methodology/approach...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (4): 45–54.
Published: 18 September 2009
...Hongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim Purpose The purpose of this paper is to describe a local melt process of solder bumping employed in electronic packaging applications by an induction heating reflow method, for a combined numerical and experimental study involving...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (2): 7–13.
Published: 01 August 2001
...Jennie S. Hwang; Zhenfeng Guo; Holger Koenigsmann With the established surface mount infrastructure and the temperature constraints of components and printed circuit boards, the melting temperatures of lead‐free solder alloys need to be designed as close to 63Sn/37Pb as practical, and not to exceed...
