... The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value...

... blending various weight percentages (0‐2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were...

... paraffin oil and both without and with the application of ultrasonic vibration, were marked as B‐ and C‐samples, respectively. Solders Alloys Nanotechnology Melting point Lead The Sn‐Pb has been the most widely used solder alloy system as an interconnection material in the electronic...