...Ashutosh Sharma; Byungmin Ahn Purpose The purpose of this paper is to investigate the influence of pulse plating current density on the morphology and solderability of Pb-free Sn-Cu solder coatings prepared from alkaline stannate baths. Design/methodology/approach Sn-Cu solder coatings were...

...Wei Liu; Rong An; Chunqing Wang; Yanhong Tian Purpose – The purpose of this paper is to investigate the effect of typical morphologies of Au-Sn IMCs (intermetallic compounds) at the interfaces of solder and pads on shear properties of laser reflowed micro-solder joints. Design/methodology...