...Jayashri Bangali; Sunit Rane; Girish Phatak; Shashikala Gangal Purpose The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired ceramics technology (LTCC), especially...

...R. Durairaj; T.A. Nguty; N.N. Ekere The paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on the printing performance. As the current product miniaturisation trend continues, area...

...F.J. de Klein Reflow soldering in a controlled O₂ atmosphere will lead to practical benefits in the wetting behaviour of solder pastes. The required O₂ level and its control depend on the solder paste used and the solderability of the materials to be joined. For a typical...