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Keywords: Pin-in-paste
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Journal Articles
New method for determining correction factors for pin-in-paste solder volumes
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 2–9.
Published: 06 February 2017
...Oliver Krammer; Bertalan Varga; Karel Dušek Purpose This paper aims to present a new method to calculate the appropriate volume of solder paste necessary for the pin-in-paste (PIP) technology. By the aid of this volume calculation, correction factors have been determined, which can be used...
Journal Articles
Solder joint imagery compressing and recovery based on compressive sensing
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (3): 129–138.
Published: 27 May 2014
... Solder Pin-in-paste Let M be the number of measurements (the row dimension of y) sufficient for a high probability of successful reconstruction, and M is determined by: Equation 3 . For some positive constant C, μ(Φ, Ψ) is the coherence between...
