...Weisheng Xia; Ming Xiao; Yihao Chen; Fengshun Wu; Zhe Liu; Hongzhi Fu Purpose – The purpose of this paper is to study the thermal warpage of a plastic ball grid array (PBGA) mounted on a printed circuit board (PCB) during the reflow process. Design/methodology/approach – A thermal...

... in relation to the number of reflow cycles. The test assemblies consisted of tin‐lead and lead‐free solder joints, and solder joints made with lead‐free solder paste and lead‐containing plastic ball grid array (PBGA) components. The number of voids and their size were determined for each assembly...

... strength of plastic ball grid array (PBGA) packages. An effective thickness is identified for the 2‐D finite element analysis. By using this effective thickness as a scale factor, it is shown that the 2D model is feasible for the study of 3‐D problems. The computational model is validated by experimental...

...Shi‐Wei Ricky Lee; John H. Lau A computational parametric study on the solder joint reliability of a plastic ball grid array (PBGA) with solder bumped flip chip (FC) is presented. The basic configuration of the PBGA is 27mm package‐size and 1.27mm ball‐pitch. There were three kinds of ball...

... standoff height between different PBGA coplanarity groups, where different experiment variables were applied, allowed for determination of the variation of BGA solder joint integrity. © MCB UP Limited 1999 Plastic ball grid array Reliability Solders The eutectic solder balls...

... Plastic ball grid array Reliability Soldering Solder joint Input/output (I/O) requirements for integrated circuit (IC) packages continue to increase with increasing levels of circuit integration, while the package size continues to decrease. Currently, IC chips with high numbers of I/O...

...S.‐W. Ricky Lee; John H. Lau A computational model was established in this study to simulate cavity‐down plastic ball grid array (PBGA) assemblies. Stress analysis was performed to investigate the solder joint reliability of a PBGA‐PCB (printed circuit board) assembly. The packages under...

...R. Munamarty; P. McCluskey; M. Pecht; L. Yip Two types of Plastic ball Grid array packages, a 225‐lead full matrix array and a 256‐lead perimeter array, were subjected to 168 hours of moisture preconditioning at 85°C and 30% relative humidity followed by simulated infra‐red reflow at temperature...