...Weisheng Xia; Ming Xiao; Yihao Chen; Fengshun Wu; Zhe Liu; Hongzhi Fu Purpose – The purpose of this paper is to study the thermal warpage of a plastic ball grid array (PBGA) mounted on a printed circuit board (PCB) during the reflow process. Design/methodology/approach – A thermal...

... grid array (PBGA) components, next the ones prepared with lead‐free solder paste and tin‐lead‐silver PBGA components, and last the ones prepared with tin‐lead solder paste and tin‐lead‐silver PBGA components. © MCB UP Limited 2003 Lead‐free Reliability Plastic ball grid array...

... strength of plastic ball grid array (PBGA) packages. An effective thickness is identified for the 2‐D finite element analysis. By using this effective thickness as a scale factor, it is shown that the 2D model is feasible for the study of 3‐D problems. The computational model is validated by experimental...

...Shi‐Wei Ricky Lee; John H. Lau A computational parametric study on the solder joint reliability of a plastic ball grid array (PBGA) with solder bumped flip chip (FC) is presented. The basic configuration of the PBGA is 27mm package‐size and 1.27mm ball‐pitch. There were three kinds of ball...

... standoff height between different PBGA coplanarity groups, where different experiment variables were applied, allowed for determination of the variation of BGA solder joint integrity. Plastic ball grid array Reliability Solders The eutectic solder balls of plastic ball grid array (PBGA...

... between the thickness and characteristics of the IMC layer and the ball shear strengths is presented and discussed in detail. Plastic ball grid array packages with 292 solder balls were used in this study. Two kinds of ball pad metallurgy are considered, electrolytic Ni/Au and electroless Ni/Au...

...S.‐W. Ricky Lee; John H. Lau A computational model was established in this study to simulate cavity‐down plastic ball grid array (PBGA) assemblies. Stress analysis was performed to investigate the solder joint reliability of a PBGA‐PCB (printed circuit board) assembly. The packages under...

...R. Munamarty; P. McCluskey; M. Pecht; L. Yip Two types of Plastic ball Grid array packages, a 225‐lead full matrix array and a 256‐lead perimeter array, were subjected to 168 hours of moisture preconditioning at 85°C and 30% relative humidity followed by simulated infra‐red reflow at temperature...