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Keywords: PoP technology
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 23–27.
Published: 06 February 2017
... Licensed re-use rights only PoP technology Surface mount technology (SMT) Solder joints reliability 3D PoP structures The market for mobile devices is growing rapidly and enforcing the demand for faster, smaller and more functional components and assembly solutions. Therefore, new three...
Journal Articles
Marek Kościelski, Janusz Sitek, Wojciech Stęplewski, Grazyna Kozioł, Piotr Ciszewski, Tomasz Krzaczek
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 103–107.
Published: 01 June 2015
...Dr Agata Skwarek; Marek Kościelski; Janusz Sitek; Wojciech Stęplewski; Grazyna Kozioł; Piotr Ciszewski; Tomasz Krzaczek Purpose – The purpose of this paper is to present challenges met during package-on-package (PoP) technology implementation in real surface-mount technology assembly processes...
Journal Articles
Janusz Sitek, Wojciech Stęplewski, Kamil Janeczek, Marek Kościelski, Krzysztof Lipiec, Piotr Ciszewski, Tomasz Krzaczek
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 98–102.
Published: 01 June 2015
... material was presented. Janusz Sitek can be contacted at: janusz.sitek@itr.org.pl © Emerald Group Publishing Limited 2015 PoP systems PoP technology SMT Solder joints reliability Package-on-Package (PoP) is one of the major three-dimensional (3D) packaging approaches...
