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Keywords: Power module
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Journal Articles
Reliability study of large-area sintered Cu for power electronic packaging
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–11.
Published: 03 June 2026
... Publishing Limited 2026 Emerald Publishing Limited Licensed re-use rights only Power module Cu sintering Large-area bonding Reliability Key R&D Program Project of Guangxi Province AD25069094 Guilin Science and Technology Development Plan Project 20230125-1 Innovation...
