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Keywords: QFP
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Journal Articles
Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering
Available to PurchasePeng Xue, Song‐bai Xue, Liang Zhang, Yi‐fu Shen, Li‐li Gao, Sheng‐lin Yu, Hong Zhu, Zongjie Han, Yan Chen
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 177–183.
Published: 28 June 2011
...Peng Xue; Song‐bai Xue; Liang Zhang; Yi‐fu Shen; Li‐li Gao; Sheng‐lin Yu; Hong Zhu; Zongjie Han; Yan Chen Purpose The purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal...
