Keywords: Rework
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Journal Articles
Soldering & Surface Mount Technology (2001) 13 (2)
Published: 01 August 2001
... © MCB UP Limited 2001 --> GenRad Rework GenRad's new Summit 750 improves productivity Keywords: GenRad, Rework GenRad, Inc. has announced the Summit 750 entry-level rework system, designed to improve productivity and reduce production line failures for contract...
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (2)
Published: 01 August 2001
... Automation are supplying the Freedom 3000 Rework Station from Conceptronic. Freedom 3000 is an advanced, easy-to-use BGA rework and replacement system. Devices are placed, soldered and removed and this machine is best suited for BGA, CSP, flip-chip or leaded components. The system is ideal...
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (1)
Published: 01 April 2001
... © MCB UP Limited 2001 --> GenRad Rework GenRad delivers best rework station performance for global printed circuit board manufacturers Keywords: GenRad, Rework GenRad, Inc. has announced an efficient solution for reworking printed circuit boards. Six new...
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (1)
Published: 01 April 2001
... © MCB UP Limited 2001 --> PAF systems Rework Workstations for manual assembly and rework Keywords: PAF systems, Rework PAF Systems workstations can now be equipped with the full range of rework solutions, courtesy of PACE. The workstations are fully ESD compliant...
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (1)
Published: 01 April 2001
... © MCB UP Limited 2001 --> PAF Systems Rework PAF launch in-line vertical buffer unit Keywords: PAF Systems, Rework This latest innovation from PAF Systems is claimed to be unique to the industry, designed primarily for pre and post inline AOI/ICT configurations...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (3)
Published: 01 December 2000
... Keywords Publication, Rework, Metcal Production tools and rework specialist, Metcal, has made access to its industry-leading expertise in BGA rework even more accessible to European customers with the launch of a dedicated CD-ROM. The highly comprehensive CD includes a wealth...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (3): 35–38.
Published: 01 December 2000
...T.A. Nguty; N.N. Ekere; J.D. Philpott; G.D. Jones High‐density packaging devices have unique characteristics which make their assembly, test and repair very difficult. The only realistic method of rework is to replace the defective component with a new or re‐balled component. Although a wide range...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
.... Tel: +44 (0) 2380 489100; Fax: +44 (0) 2380 489109; E-mail: xdaval@okinternational.com © MCB UP Limited 2000 --> Metcal Heaters Rework Ball grid array Keywords Metcal, Heaters, Rework, Ball grid array The complexity and reduced size of array packages, such as BGAs...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Loctite Underfill Rework Keywords Loctite, Underfill, Rework Package rework is a normal occurrence in board level assembly. And now there is a fast flowing, snap cure underfill that allows for package rework, virtually eliminating costly board...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3): 12–22.
Published: 01 December 1999
...M. Wickham; C.P. Hunt A survey of rework practices of the UK electronics assembly industry has been undertaken. Rework of electronics components in the UK was found to be dominated by the use of soldering irons. Many companies did not control tip temperatures, rework times, background heating...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3)
Published: 01 December 1999
...Mike Judd; Tom Perrett © MCB UP Limited 1999 --> SMART Rework SMART Group rework seminar/workshop ­ 13th May 1999, Coventry Keywords SMART, Rework A general introduction to rework was given by the event co-ordinator Simon Hawkins of OK Industries. The various...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (2): 7–11.
Published: 01 August 1999
...A.D. Stennett; D.C. Whalley Component removal for rework and repair is traditionally achieved by re‐melting of the solder, but the exposure of the assembly or its component parts to repeated soldering/ desoldering cycles may cause both immediate damage and create a significant long term reliability...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (2)
Published: 01 August 1999
... © MCB UP Limited 1999 --> A.P.E. Rework Surface mount technology CHIPPER™ rework system removes, replaces BGA/SMT/QFP devices Keywords A.P.E., Rework, Surface mount technology The A.P.E. Chipper™SMD-500 is a compact, benchtop hot air based rework system designed...

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