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Keywords: Sn-Ag-Cu solder
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Journal Articles
Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition
Available to PurchaseWan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu Bakar
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 102–108.
Published: 02 April 2019
... 2018 20 12 2018 © Emerald Publishing Limited 2019 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu solder Blast wave Microstructure Intermetallic layers Hardness properties Open-field air blast test was conducted at the explosive research area...
