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Keywords: Sn-Ag-Ti solder
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 93–101.
Published: 02 April 2019
...Roman Koleňák; Igor Kostolný; Jaromír Drápala; Martin Kusý; Matej Pašák Purpose This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied. Design/methodology/approach...
