Keywords: Solder joints reliability
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Journal Articles

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Janusz Sitek, Marek Koscielski, Janusz Borecki, Tomasz Serzysko
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 23–27.
https://doi.org/10.1108/SSMT-10-2016-0024
Published: 06 February 2017
... powder had positive effect on solder joints reliability in 3D PoP structures. Especially important was the selection of solder paste for “Bottom” layer of 3D PoP system (influence 17 per cent). Incorrect soldering profile (influence 46 per cent) or wrong selected PCB coating (influence 35 per cent) can...
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Journal Articles

Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

Janusz Sitek, Wojciech Stęplewski, Kamil Janeczek, Marek Kościelski, Krzysztof Lipiec, Piotr Ciszewski, Tomasz Krzaczek
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 98–102.
https://doi.org/10.1108/SSMT-03-2015-0011
Published: 01 June 2015
...Dr Agata Skwarek; Janusz Sitek; Wojciech Stęplewski; Kamil Janeczek; Marek Kościelski; Krzysztof Lipiec; Piotr Ciszewski; Tomasz Krzaczek Purpose – The purpose of this paper is to evaluate the influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP...
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