...H. Rhee; K.N. Subramanian Purpose To understand the roles of service‐related parameters, such as imposed cyclic strain amplitude and cyclic strain rate, on the stress relaxation behaviour of eutectic Sn‐Ag solder joints. Design/methodology/approach Cyclic shear straining with associated stress...

... film resistors the effects of stress on the alumina body can be determined and described for the whole temperature range of interest. The complete system of component, PCB/substrate and solder joint will be discussed and different influences will be isolated. It will be shown that CTE‐matching...

...¢/G¢¢ and recovery) and meta‐rigidity (yield stress); slump resistance is proportional to elastic properties (recovery), solid characteristics (stress [G¢ = G¢¢]), and rigidity (|G*|); and that high elastic properties (recovery), low compliance (J1 and J2), and low solid characteristics (stress [G...