...Min Wu; Xiangyu Su Purpose Because of the complexity of relationship between surface tension and its decisive factors, such as temperature, concentration, electronic density, molar atomic volume and electro-negativity, a reasonable predicting model of surface tension of Sn-based solder alloys has...

...Przemyslaw Fima; Tomasz Gancarz; Janusz Pstrus; Krystyna Bukat; Janusz Sitek Purpose The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior...

... 2010 Emerald Publishing Limited Licensed re-use rights only Substrates High temperatures Cyclic loading Surface tension Fatigue Testing conditions Al₂O₃-DBC substrates are widely used because of their advantages such as low-cost, high mechanical strengths...

..., however, successfully correlates the weakening solder joints with the thickening and shape changes of IMC(s) in a direct way. Yi‐Shao Lai can be contacted at: yishao_lai@aseglobal.com © Emerald Group Publishing Limited 2009 Soldering Joining processes Impact strength Surface tension...

...M. Nowotarski; R. De Wilde ** The effects of oxygen on solder surface tension, wetting time and surface damping are presented. Oxygen levels greater than 10 ppm lower surface tension, increase wetting time and increase surface damping. Decreased surface tension leads to higher misalignment defects...