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Keywords: TSOP
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Journal Articles
Reliability Evaluation of TSOP Solder Joints for PC Card Application
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1996) 8 (2): 29–32.
Published: 01 August 1996
...J. Seyyedi; R. lannuzzelli; J. Bukhari As part of the portable product interconnects characterisation programme, the present investigation was conducted to determine the attachment integrity and long‐term reliability of Thin small Outline package (TSOP) solder joints. Accelerated thermal cycling...
