...@imim‐pan.krakow.pl © Emerald Group Publishing Limited 2012 Alloys Solders Thermal properties of materials Physical properties of materials Sn‐Ag‐Cu Density Surface tension Viscosity Wetting Alloys from the Sn‐Ag‐Cu system, mainly Sn3.5Ag and Sn3.5Ag0.9Cu (wt%), are most...

...) also indicated that the original Norris‐Landzberg model works quite accurately in lead‐free assemblies, whereas Salmela (2007) proposed a stress‐dependent model for both Engelmaier's and Norris‐Landzberg's models. Solders Thermal properties of materials Metals Fatigue Next, the obtained...

... the fracture interface was in the bulk solder and/or component metallization, not in the IMC layer. © Emerald Group Publishing Limited 2009 Thermal properties of materials Soldering Solders Alloys Long‐term reliability of solder interconnections depends on intermetallic compound (IMC...

... . © Emerald Group Publishing Limited 2009 Copper High temperatures Fatigue Substrates Thermal properties of materials Packaging Direct‐bond‐copper (DBC) substrates have been used in electronics packaging for several years and research on material properties has been conducted...

... Thermal properties of materials Usage of the ball grid array (BGA) has become popular in today's electronic hardware industry. Owing to the hermetic design requirement in some electronic systems for military applications, the use of the ceramic BGA (CBGA) is imminent. It is well known...