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Keywords: Thermal stressing
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Journal Articles
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (3): 183–190.
Published: 02 December 2021
... under thermal stressing. Specifically, based on the observation and analysis results of microstructure and internal structure of composite solder joint, the TiN particle can change the temperature gradient distribution of the solder joint, so as to suppress the diffusion and migration of Sn and Cu atoms...
