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1-6 of 6
Keywords: Thermal testing
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Journal Articles
Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering
Available to PurchasePeng Xue, Song‐bai Xue, Liang Zhang, Yi‐fu Shen, Li‐li Gao, Sheng‐lin Yu, Hong Zhu, Zongjie Han, Yan Chen
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 177–183.
Published: 28 June 2011
... Song‐bai Xue can be contacted at: xuesb@nuaa.edu.cn © Emerald Group Publishing Limited 2011 Soldering Solders Tensile strength Microstructure QFP Thermal testing The European Union directive on the restriction of hazardous substances came into effect on July 1, 2006 (Lin...
Journal Articles
Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 161–167.
Published: 28 June 2011
... and lifetime predictions are now presented. Jue Li can be contacted at: juliusjueli@gmail.com © Emerald Group Publishing Limited 2011 Crack growth Fracture Finite element analysis Product reliability Lifetime prediction Reliability Solders Thermal testing Shock tests SAC SnAgCu...
Journal Articles
Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead‐free 2nd level interconnections in LTCC/PWB assemblies
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (3): 22–35.
Published: 29 June 2010
.... The main dimensions, stencil sizes and material compositions can be found in Table II . The test modules were soldered to PWBs, each capable of encompassing nine modules, producing one SAC387/PCSB/SAC assembly and one SAC‐In/PCSB/SAC assembly. Electrodeposition Coating processes Metals Thermal...
Journal Articles
Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 28–38.
Published: 10 April 2009
... at: jliu@chalmers.se © Emerald Group Publishing Limited 2009 Lead Solders Thermal testing Stress (materials) Finite element analysis Modelling Owing to environmental concerns, the requirement for lead‐free manufacturing is now a worldwide demand. From July 1, 2006, lead has been...
Journal Articles
Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (1): 13–21.
Published: 08 February 2008
... Limited 2008 Solder Soldering Diffusion Thermal testing Vibration Ageing (materials) Lead‐containing solders have been widely used in the electronic industry for many years. As a consequence of environmental responsibility and technological request, alternative lead‐free solders have...
Journal Articles
Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (3): 51–60.
Published: 01 December 2002
... of 10,354 brick and wedge elements and is shown in Figure 8 . The finite element mesh shown in the figure is the result of a systematic refinement study involving geometry, material behaviour and mesh (Towashiraporn and Subbarayan, 2002). Thermal testing Finite element method Fatigue...
