... Emerald Group Publishing Limited 2011 Soldering Solders Tensile strength Microstructure QFP Thermal testing The European Union directive on the restriction of hazardous substances came into effect on July 1, 2006 (Lin et al., 2008) and this has meant that most electronics...

...@gmail.com © Emerald Group Publishing Limited 2011 Crack growth Fracture Finite element analysis Product reliability Lifetime prediction Reliability Solders Thermal testing Shock tests SAC SnAgCu Electronic products have become a necessity in everyday life due to their wide use...

... Group Publishing Limited 2010 Electrodeposition Coating processes Metals Thermal testing A post‐processed deposit layer is a useful solution to avoid the above‐mentioned problems. Therefore, an electroless NiAu (ENIG) surface finish has been used in LTCC packages with a high...

... alloys. J. Liu can be contacted at: jliu@chalmers.se © Emerald Group Publishing Limited 2009 Lead Solders Thermal testing Stress (materials) Finite element analysis Modelling All solder joints analyzed in this work by means of cross sectioning were carefully cut, ground...

... Thermal testing Vibration Ageing (materials) Lead‐containing solders have been widely used in the electronic industry for many years. As a consequence of environmental responsibility and technological request, alternative lead‐free solders have to be developed (Anderson, 2007). These new...

.... Thermal testing Finite element method Fatigue © MCB UP Limited 2002 The use of accelerated tests to characterize the reliability of electronic packages is well established at the present time in the microelectronics industry. The widely prevalent accelerated life test at the present time...