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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (1): 22–26.
Published: 08 February 2008
..., 240, 250 and 270°C. The wetting balance tester had immersion time of 15 s, immersion speed of 15 mm/s, immersion depth of 9.9 mm and the measurement range was set to a maximum of 5 mN. The substrate was Cu wire with a diameter of 1 mm. The pretreatment process of the Cu substrate was as follows...
