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Journal Articles
Soldering & Surface Mount Technology (2001) 13 (2): 14–20.
Published: 01 August 2001
...John H. Lau An exact analysis is presented of the creep deformation of cylindrical solder interconnects subjected to the actions of bending moments, twisting moments, and axial forces. Dimensionless interaction curves and charts are also provided for engineering practice convenience. These charts...

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