Bending and twisting of cylindrical solder interconnections with creep Available to Purchase

An exact analysis is presented of the creep deformation of cylindrical solder interconnects subjected to the actions of bending moments, twisting moments, and axial forces. Dimensionless interaction curves and charts are also provided for engineering practice convenience. These charts show the interactions of the relevant variables, i.e. interconnect geometry; solder material properties; axial force; bending moment; twisting moment; bending stress; shearing stress; curvature rate; and twist rate. In the results presented the Garofalo‐Arrhenius steady‐state creep equation is used to provide the constitutive relationship for SnPb36Ag2 solder interconnects.