... parameters for solder joint performance during thermal cycling and is demonstrated on flip‐chip components using “no‐flow” underfills. To implement “optimisation in reliability” approach, the finite element simulation tool – PHYSICA, is coupled with optimisation and statistical tools. This resulting...

...Zhang Qun; Xie Xiaoming; Chen Liu; Wang Guozhong; Cheng Zhaonian; Wolfgang Kempe The lifetime of flip chip solder joints can be greatly increased by applying underfill encapsulation. This paper presents a case study where the thermal cycle lifetime was increased by more than 20 times, that is from...

...Jicun Lu; Jianhua Wu; Yih Pin Liew; Thiam Beng Lim; Xiangfu Zong The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test...

... © MCB UP Limited 2000 --> Loctite Underfill Rework Keywords Loctite, Underfill, Rework Package rework is a normal occurrence in board level assembly. And now there is a fast flowing, snap cure underfill that allows for package rework, virtually eliminating costly board...

...Brian Ellis Having got that off my chest, the book itself is divided into just seven chapters plus a glossary and, of course, an index. The first one is a short general introduction to the materials and techniques used for "glob-top" and underfill encapsulation, to provide the right background...

...M.B. Vincent; C.P. Wong This paper presents results on adding silane coupling agents to the underfill encapsulant to enhance the rheology and wetting of the underfill. These results include rheology measurements, contact angle measurements, and in situ flows using a simulated test chip...

... © MCB UP Limited 1999 --> Multicore Underfill New "no flow" flip-chip underfill dramatically improves joint yield Keywords Multicore, Underfill New, pre-deposited,self-fluxing flip-chip underfill from Multicore Solders reduces voids and incomplete filling...

... compared to conventional post‐deposited underfills. The development sequence and the procedure for characterisation of material properties, including the evaluation of the effectiveness of the fluxing action on a range of solder alloys, is documented. A typical application is described, outlining how...

...) of isotropically conductive adhesive and of solder (63Sn37Pb, 96.5Sn3.5Ag) bumps caused by both thermal cycling and thermal shock will be described. These investigations confirm that in the low‐cost flip‐chip technology there is practically no reliable bump interconnection without using an underfill material. ©...