... be contacted at: aizatabas@usm.my 29 11 2024 17 03 2025 25 03 2025 © 2025 Emerald Publishing Limited 2025 Emerald Publishing Limited Licensed re-use rights only Machine learning Electronic packaging Flip-chips Underfill encapsulation Voiding Dispensing orientations...

... Limited Licensed re-use rights only Machine learning Voiding Electronic packaging Flip-chips Underfill encapsulation Convolutional neural networks (CNN) have been expanding in applied computer vision for quality control in the microelectronics sector. One issue plaguing the multi...

... Emerald Publishing Limited Licensed re-use rights only Electronic packaging Flip-chips Underfill encapsulation Voiding Machine learning BJIM USMIndustry Matching Research 1001.PMEKANIK.8070022 USM-Western Digital Corp 311/PMEKANIK/4402055 The miniaturisation of components...

... the bump exit. Using the commercially available FVM-based software, ANSYS Fluent, the underfill encapsulation process in the flip-chips was numerically simulated. The three-dimensional underfill fluid flow in the flip-chip is modeled to be unsteady, laminar and incompressible. To track the flow...

...Fei Chong Ng; Mohamad Aizat Abas Purpose This paper aims to present new analytical model for the filling times prediction in flip-chip underfill encapsulation process that is based on the surface energetic for post-bump flow. Design/methodology/approach The current model was formulated based...

...Fei Chong Ng; Mohamad Aizat Abas; Mohd Zulkifly Abdullah Purpose This paper aims to introduce a new indicative parameter of filling efficiency to quantify the performance and productivity of the flip-chip underfill encapsulation process. Additionally, the variation effect of the bump pitch of flip...