...Daniel Straubinger; István Bozsóki; Balazs Illes; Oliver Krammer; David Bušek; Attila Geczy Purpose The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB...

...Mohamed Amine Alaya; Attila Geczy; Balazs Illes; Gábor Harsányi; David Bušek Purpose The purpose of the paper is to improve the control of vapour phase soldering (VPS). To enable better productivity and assembling quality, the industry needs to provide precise control and measurements during...

...Oliver Krammer; Péter Martinek; Balazs Illes; László Jakab Purpose This paper aims to investigate the self-alignment of 0603 size (1.5 × 0.75 mm) chip resistors, which were soldered by infrared or vapour phase soldering. The results were used for establishing an artificial neural network...

...Lubomir Livovsky; Alena Pietrikova Purpose The purpose of this paper is to investigate measurement and regulation of saturated vapour height level in vapour phase soldering (VPS) chamber based on parallel plate capacitor and retaining a stable saturated vapour level above the boiling fluid...

...Balázs Illés; Attila Géczy; Bálint Medgyes; Gábor Harsányi Purpose This paper aims to present a review of the recent developments in vapour phase soldering (VPS) technology. This study focuses on the following topics: recent developments of the technology, i.e. soft and vacuum VPS; measurement...

...Lubomir Livovsky; Alena Pietrikova Purpose This paper aims to present a new method of real-time monitoring of thermal profiles applied in vapour phase soldering (VPS) reflow processes. The thermal profile setting is a significant variable that affects the quality of joints. The method allows rapid...

...Attila Geczy; Daniel Nagy; Balazs Illes; Laszlo Fazekas; Oliver Krammer; David Busek Purpose The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular plate from the aspect...

... parameters. Oliver Krammer can be contacted at: krammer@ett.bme.hu © Emerald Group Publishing Limited 2016 Pb-free Interfacial cracking X-ray imaging Computed tomography Thermal shock test Vapour phase soldering The quality and thermo-mechanical properties of solder alloys...

...Dr Agata Skwarek; Attila Géczy; Bíborka Kvanduk; Balazs Illes; Gábor Harsányi Purpose – The paper aims to present a comparative study of various thermocouple (TC) attaching methods for the proper measurement of soldering temperature profiling during vapour phase soldering (VPS). The heat transfer...

... test Vapour phase soldering To compare VP and conventional IR reflow soldering, experiments were performed where 0603-sized (1.50 × 0.75 mm) chip resistors were soldered with both of the heat transfer methods. After soldering, mechanical investigations and cross-section analyses were...

.... Design/methodology/approach Different pressure sensors were applied in an experimental vapour phase soldering (VPS) station, where the hardware setup was dedicated to the current experiments. Static and dynamic pressure values were analyzed and correlated with additional thermal measurements...