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Keywords: Wafer-level package
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2026) 38 (4): 308–318.
Published: 26 May 2026
... 2026 23 04 2026 © 2026 Emerald Publishing Limited 2026 Emerald Publishing Limited Licensed re-use rights only Copper nodule Wafer-level electroplating Process optimization Reliability Wafer-level package Jiangsu Province Innovation Support Program BK20243020...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (2): 71–78.
Published: 01 April 2014
... Interconnects Pb-free Solder joints Stencil printing Wafer-level package Numerous factors determine the quality of the printed deposits such as the stencil, solder paste, printing parameters, printer, squeegee and environmental conditions (Haslehurst and Ekere, 1996 ; Nguty et al., 1999...
