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Journal Articles
Journal Articles
Soldering & Surface Mount Technology (2015) 27 (1): 31–44.
Published: 02 February 2015
...M.S. Abdul Aziz; M.Z. Abdullah; C.Y. Khor Purpose – This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation. Design/methodology/approach...
Journal Articles
Soldering & Surface Mount Technology (2014) 26 (3): 97–109.
Published: 27 May 2014
...Mohd Sharizal Abdul Aziz; Mohd Zulkifly Abdullah; Chu Yee Khor Purpose – The aim of this study is to investigate the effects of offset angle in wave soldering by using thermal fluid structure interaction modeling with experimental validation. Design/methodology/approach – The authors used...
Journal Articles
Soldering & Surface Mount Technology (2003) 15 (2)
Published: 01 August 2003
... © MCB UP Limited 2003 --> Wave soldering Lead-free wave soldering evaluation update Keyword: Wave soldering Wave soldering is the main assembly process, which will be impacted by a change to lead-free alloys. With the signing of WEEE directive in Europe...
Journal Articles
Soldering & Surface Mount Technology (2003) 15 (2): 28–34.
Published: 01 August 2003
...Teo Kiat Choon It was observed that “no solder” or “skipped solder” defects occurred on a particular printed circuit board assembly product during wave soldering. Investigations were carried out to find out the cause of this defect and to recommend an optimal hot air level coating thickness...
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (1): 19–25.
Published: 01 April 2001
...Tim Lawrence; Ian Wilding; Balvinder Chowdhary This paper outlines the current position of water based no‐clean liquid fluxes for wave soldering. The primary differences between these and “traditional” alcohol based liquid fluxes are explored using wetting balance methods. Reduced wetting...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (3): 29–34.
Published: 01 December 2000
...Atso Forstén; Hector Steen; Ian Wilding; Jürgen Friedrich Though lead‐free replacements for SnPb eutectic alloys for reflow, wave, and hand soldering have been developed, relatively little has been reported on practical experience of lead‐free wave soldering processes. In wave soldering...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> ECD Instruments Temperature Reflow Wave soldering Keywords ECD Instruments, Temperature, Reflow, Wave soldering ECD has announced its new AutoM.O.L.E® temperature profiling system for reflow ovens and wave solder machines. When preloaded onto...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> Heraeus Cleaning Ovens Wave soldering Heraeus launches a new cleaner for removing flux residues from reflow ovens and wave solder machines Keywords: Heraeus, Cleaning, Ovens, Wave soldering Heraeus Materials has announced...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Speedline Wave soldering Speedline launches high-speed flexible wave soldering system Keywords Speedline, Wave soldering Speedline Electrovert has launched Vectra, a flexible, high-speed wavesoldering system designed for medium to high...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3)
Published: 01 December 1999
.... Additionally, real-time graphic animation and data windows enable full and accurate process control, including the ability to process various boards of up to 457mm (18in.). © MCB UP Limited 1999 --> Speedline Wave soldering New high-speed, user-friendly wave soldering system from...

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