Issues

Appointments

Knight joins the board at Speedboard

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An expatriate Breton in Britain

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AlliedSignal Inc. have announced senior executive appointments in their Electronic Materials business unit

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Etec appoints Dr Jim Hickman to key advisory role in the interconnect products group

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New appointments at Coates

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Valor appoints its first VP marketing and a new president of European operations

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Association news

IPC board welcomes Universal Instruments' president

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General H. Norman Schwarzkopf to keynote IPC SMEMA Council's APEX

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IPC awards three Teledyne employees for best technical paper

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IPC releases printed circuits Expo attendance figures

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IPC names Printed Circuits Expo technical program committee

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IPC announces dates for surface finishes conference

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PCIF, SAMC adopt IPC design certification program

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Industry offers alternative to EU's proposed ban on tin-lead solder

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Call for papers issued for IPC printed circuits EXPO 2000

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Author and title index to volume 25, 1999

Author and title index to volume 25, 1999

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Book review

Printed Circuit Board Materials Handbook

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Business news

Orbotech and Valor announce joint venture with respect to CAM operations

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Final agreement of Flextronics acquisition of manufacturing division of ABB SATT AB

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Modest improvement in N. America

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Coates chairman retires

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Astron announces acquisition of Advanced Component Labs HK Ltd (ACL)

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New Vutrax internet forum

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Coates open new German subsidiary

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The constraints of vias and layers and their impact on PCB design strategy

P.J. Palmer; D.J. Williams
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New normal‐propyl bromide based cleaning technology for the electronics industry

Suae‐chen Chang; Ronald L. Shubkin
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Optimal printed wiring board design for high I/O density chip size packages

Chirag S. Patel; Kevin P. Martin; James D. Meindl
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Controlling emissions stemming from the hot air solder leveling process

Matthew A. Lee
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Use of Organic Metal to enhance the operating window and solderability of immersion tin

Bernhard Wessling
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Editorial

Literati Awards for Excellence

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Frank Coultard column

The DTI/PCIF technology mission on

Frank Coultard
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Industry news

Shipley Ronal announces restructuring of European manufacturing

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Printed circuit board manufacturers have aggressive water recycling plans

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Teknek Electronics Ltd move to new factory

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Labtech strengthens presence in France

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Microtech management buy-out

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Labtech awarded European Space Agency approval for metal-backed PCBs

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Business introduces advanced electronic substrate materials to serve emerging markets with enabling technologies for high-performance applications

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Technic announces sale of Baker Brothers' waste treatment to Kinetico Inc.

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Speedboard continues expansion drive

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Microtech install additional drilling capability

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CREO Ltd announces completion of its sub-2mil LDI mini-lab and process lab

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The evolution of compatibility

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Launch of new industry standard for PCB reliability

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Ruwel certified as the first European producer by VDE

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Industry statistics

JPCA

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International diary

International diary

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Internet commentary

How shines your tower, the only one Of that especial site and stone! Edmund Blunden, The Survival

Brian Ellis
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New products

The new CM6 and XCM2: a platform for increased yields

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Probetest exhibits new Dragonfly flying probe tester

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Orbotech announces new direct imaging system

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Valor launches ODB++ gateway format for fast third party EDA integration

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New CMI 900 series X-ray fluorescence system

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New European source for high integrity flex-rigid multilayer circuits

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Latest version of Vutrax® PCB design software is launched

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Probot Inc. announces introduction of new moving probe tester

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AOI for BGA carriers

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UV curable epoxide technology for the twenty-first century

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Nelco introduces two advanced materials providing faster processing speeds

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ENVISION® DMS-E direct metallization system introduced to North America

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Obituary

Obituary

Alun Morgan
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PCIF news

Millennium bug Website for electronics manufacturing

Ken Cosslett
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ICT 25th Anniversary Symposium

Ken Cosslett
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PCIF opposes Government's climate change levy

Ken Cosslett
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Short communication

Testing for the synergistic compatibility of process chemistries using surface insulation resistance measurements

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