... deposited on the backside of AlGaN/GaN-on-Si dies on the assembly process is also investigated. Design/methodology/approach The authors assumed the value of the shear strength to be a basic parameter for evaluation of mechanical properties. Additionally, the surface condition after shearing was assessed...

...@elka.pw.edu.pl 26 10 2017 29 11 2017 04 12 2017 © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use rights only Assembly Sensors BSA Current-voltage measurements ISFET Membrane modification National Science Centre N N515 498140 UMO-2011/01...

...Liang Wang; Maarten Cauwe; Steven Brebels; Walter De Raedt; Jan Vanfleteren Purpose – Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher density integration and bending...

...Joseph Fjelstad Purpose The purpose of this paper is to describe a novel method for the manufacture of aluminum rigid‐flex circuit assemblies without the use of solder. Design/methodology/approach The approach involves the use of an aluminum base material and the embedding of components, while...

... Materials , Vol. 15 , pp. 51 ‐ 6 . Huck , W.T.S. (2007), “ Self‐assembly meets nanofabrication: recent developments in microcontact printing and dip‐pen nanolithography ”, Angewandte Chemie International Edition , Vol. 46 , pp. 2754 ‐ 7 . Jönsson , S.K.M. , Birgerson , J...

... Circuit boards Assembly Tests and testing As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high‐speed derivatives, a requirement has arisen for a practical and robust “go/no go” test technique for loss to be deployed on the PCB...

...Ehsan Saeedi; Samuel Kim; Babak A. Parviz Purpose The paper's aim is to present a method for integrating high‐performance circuit components onto flexible substrates using self‐assembly. The basic process of self‐assembly at the micrometer‐scale is reviewed and recent work in building functional...

...W. Christiaens; T. Loeher; B. Pahl; M. Feil; B. Vandevelde; J. Vanfleteren Purpose The purpose of this paper is to present results from the EC funded project SHIFT (Smart High Integration Flex Technologies) on the embedding in and the assembly on flex substrates of ultrathin chips. Design...

...Joseph Fjelstad Purpose Tin‐lead solder has been the primary method for connecting electronic components to printed circuit boards since near the time of its inception. Over the last 60 years, solder has proven a viable assembly method over that time and there is a deep understanding...

... to be able to manufacture optical PCBs. The university research is original and some has been published as shown in the publications in the reference list. Printed circuits Assembly Polymers Lasers Research © Emerald Group Publishing Limited 2008 Optical fibres have replaced copper...

... circuitry rigid until the assembly process is finished. It is described later in this section. If many flexible layers are required the multiflex circuit board should be produced with a symmetrical build up construction (Figure 6). In this case, the flexible layers are inner layers of the circuitry...

...Casper Chen; Joshua Chiang; F.Y. Lee Purpose The lead‐free soldering process has been confounding the PWB fabricators when they set out to select the right materials for lead‐free soldering. This paper discusses the compatibility of currently available laminate materials for lead‐free assembly...

...Sanka Ganesan; Michael Pecht Purpose To present and discuss open trace defects uncovered in an FR4 assembly during electrical testing. Design/methodology/approach This paper presents open trace defects observed in FR4 assemblies and analyses the distribution of defects. The paper also...

...Sylvia Ehrler Purpose Aims to explain the main requirements for printed circuit boards (PCBs) and to determine the survival rate of boards in lead‐free assembly. Design/methodology/approach The first two main requirements are the survival of 5‐6 cycles lead free reflow with peak temperatures...

...Martin Goosey Purpose To give an overview of the issues encountered, and changes that need to be made in the various types of soldering process when converting them from conventional to lead‐free assembly. Design/methodology/approach This paper has been written to provide a review of the lead...

... in the core‐layer. No other specific chemical treatments are used between the drilling and the paste printing steps. © Emerald Group Publishing Limited 2005 Printed‐circuit boards Laminates Assembly The electronics industry, driven by digitalization and mobilization, has continuously...

... circuit images is believed to be unique, and sidesteps the problems of gaining access to this information. © Emerald Group Publishing Limited 2005 Printed‐circuit‐boards Process efficiency Assembly e_L trace utilisation ratio e_H via utilisation...

... for production and subsequent assembly thereafter, and considers some of the application areas that may benefit from this novel fabrication strategy. A double‐sided LCP core is laser drilled for microvias and plated followed by imaging and etching. Shipley's PM925m^® chemical‐etch system...

... boards with better mechanical stability and improved electrical characteristics. At the same time, new environmental legislation is set to drive electronics assembly temperatures much higher as manufacturers start to use lead‐free soldering processes. The legislation is also raising questions about...

... Publishing Limited 2004 Capacitors Assembly Printed circuit boards Commercially available photodefinable epoxy systems such as Probimer 4959 epoxy and LMB 7081 were supplied by Ciba‐Geigy Corporation and XP9500CC, an epoxy‐based photoimageable dielectric, was supplied by the Shipley...