... deposited on the backside of AlGaN/GaN-on-Si dies on the assembly process is also investigated. Design/methodology/approach The authors assumed the value of the shear strength to be a basic parameter for evaluation of mechanical properties. Additionally, the surface condition after shearing was assessed...

... been investigated before in case of optoelectronic sensor (Różycki-Bakon et al., 2016). Self-assembled monolayers (SAMs) commonly refer to organic monolayers spontaneously adsorbed onto the surfaces of metals, metal oxides and semiconductors. In other cases, they can be used as molecular...

...Liang Wang; Maarten Cauwe; Steven Brebels; Walter De Raedt; Jan Vanfleteren Purpose – Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher density integration and bending...

...Joseph Fjelstad Purpose The purpose of this paper is to describe a novel method for the manufacture of aluminum rigid‐flex circuit assemblies without the use of solder. Design/methodology/approach The approach involves the use of an aluminum base material and the embedding of components, while...

... resistors is approximately 60 times higher than that of PEDOT/PSS^a. © Emerald Group Publishing Limited 2008 Electronics industry Ink jet printers Assembly Thin‐film circuits Owing to the hydrophobic nature of the printer toner, water based polymer ink is trapped between...

...Ehsan Saeedi; Samuel Kim; Babak A. Parviz Purpose The paper's aim is to present a method for integrating high‐performance circuit components onto flexible substrates using self‐assembly. The basic process of self‐assembly at the micrometer‐scale is reviewed and recent work in building functional...

... to both hand and automated test systems. Circuit boards Assembly Tests and testing For practical purposes, the robustness of a 250 ps TDR is preferred on the PCB fabrication floor. A 250 ps system, while still a sensitive RF measurement tool, is not as susceptible to ESD performance...

...W. Christiaens; T. Loeher; B. Pahl; M. Feil; B. Vandevelde; J. Vanfleteren Purpose The purpose of this paper is to present results from the EC funded project SHIFT (Smart High Integration Flex Technologies) on the embedding in and the assembly on flex substrates of ultrathin chips. Design...

...Joseph Fjelstad Purpose Tin‐lead solder has been the primary method for connecting electronic components to printed circuit boards since near the time of its inception. Over the last 60 years, solder has proven a viable assembly method over that time and there is a deep understanding...

... to be able to manufacture optical PCBs. The university research is original and some has been published as shown in the publications in the reference list. © Emerald Group Publishing Limited 2008 Printed circuits Assembly Polymers Lasers Research At high‐bit rates copper tracks...

...Casper Chen; Joshua Chiang; F.Y. Lee Purpose The lead‐free soldering process has been confounding the PWB fabricators when they set out to select the right materials for lead‐free soldering. This paper discusses the compatibility of currently available laminate materials for lead‐free assembly...

... in the flexible areas. The asymmetrical construction is not limited to two layers and circuits with several flexible and rigid layers can also be produced (Figure 5). Asymmetrical flex‐rigid circuit boards can be assembled and soldered relatively simply. A drying step before assembly is recommended due...

...Sanka Ganesan; Michael Pecht Purpose To present and discuss open trace defects uncovered in an FR4 assembly during electrical testing. Design/methodology/approach This paper presents open trace defects observed in FR4 assemblies and analyses the distribution of defects. The paper also...

...Sylvia Ehrler Purpose Aims to explain the main requirements for printed circuit boards (PCBs) and to determine the survival rate of boards in lead‐free assembly. Design/methodology/approach The first two main requirements are the survival of 5‐6 cycles lead free reflow with peak temperatures...

...) N_L number of layers N_P number of signal pins to be connected χ² a metric for the minimum PCB area required for routing This work was stimulated by the need to estimate the lifecycle cost of an electronic assembly early in the design cycle...

...Martin Goosey Purpose To give an overview of the issues encountered, and changes that need to be made in the various types of soldering process when converting them from conventional to lead‐free assembly. Design/methodology/approach This paper has been written to provide a review of the lead...

... to reductions in manufacturing lead‐time. © Emerald Group Publishing Limited 2005 Printed‐circuit boards Laminates Assembly Electrical connection between the core and the adhesive layers is realized through a thin alloy formed between the plated copper and the copper paste during lamination...

... for production and subsequent assembly thereafter, and considers some of the application areas that may benefit from this novel fabrication strategy. Shipley's PM925m^® chemical‐etch system, as developed some years back for plating LCP connector housings, would be a candidate for this type of caustic...

... boards with better mechanical stability and improved electrical characteristics. At the same time, new environmental legislation is set to drive electronics assembly temperatures much higher as manufacturers start to use lead‐free soldering processes. The legislation is also raising questions about...

... Publishing Limited 2004 Capacitors Assembly Printed circuit boards Commercially available photodefinable epoxy systems such as Probimer 4959 epoxy and LMB 7081 were supplied by Ciba‐Geigy Corporation and XP9500CC, an epoxy‐based photoimageable dielectric, was supplied by the Shipley...