... to both hand and automated test systems. Circuit boards Assembly Tests and testing For practical purposes, the robustness of a 250 ps TDR is preferred on the PCB fabrication floor. A 250 ps system, while still a sensitive RF measurement tool, is not as susceptible to ESD performance...

...Bo‐In Noh; Seung‐Boo Jung Purpose This study seeks to investigate the electrochemical migration (ECM) behaviour of printed circuit boards (PCBs) with Sn‐37Pb and Sn‐3.0Ag‐0.5Cu (wt.%) solders under various factors such as the distance between the electrodes and bias voltage. Design/methodology...

...Manfred Suppa Purpose The purpose of this paper is to present the materials and process considerations and solutions that enable the safe use of plugging pastes in high density interconnection (HDI) printed circuit boards (PCBs) designed to operate at higher temperatures. Design/methodology...

...Markus Wille Purpose The purpose of this paper is to present methods for dissipating heat from RF circuit boards. Design/methodology/approach The paper describes various models developed by RUWEL in this respect. Findings The integration of heat removal systems in the structure of printed...

...Sven Lamprecht; Günter Heinz; Neil Patton; Stephen Kenny; Patrick Brooks Purpose The purpose of this paper is to show production process developments and innovations that resolve many of the issues faced with certain process steps for printed circuit board (PCB) manufacturing following “green...

...Andrew Kelley Purpose To present an update and the latest results from work on a project aimed at enabling printed circuit board (PCB) manufacturing to reduce the effect upon production yields by material distortions during the manufacturing process. Design/methodology/approach Measurement...

...Lianyu Fu; Jianguo Qu; Haibin Chen Purpose To provide a clear picture of the current status of mechanical drilling of printed circuit boards (PCBs). Design/methodology/approach A review paper detailing the developments of micro‐drill bit and PCB mechanical drilling techniques. Findings...

... multilayer circuit boards, after exposure to a simulation of the thermal excursion associated with “tin‐lead” and “lead‐free” assembly and rework. Coupons were preconditioned by exposure to tin‐lead assembly temperatures (230°C) or lead‐free assembly temperatures (245 or 260°C). Standard statistical methods...

..., yielding an effective N.A. of 0.173. In addition, the PIN photodiodes used in the transceiver contain active areas of 70 μm diameter. The increasing physical constraints associated with copper transmission lines on printed circuit boards (PCBs) in high‐speed electronic systems has spawned...

... throughput. Originality/value The novelty of the system is that it is the first time that four inspection techniques have been combined to give the capability of 100 per cent defect coverage. © Emerald Group Publishing Limited 2007 Circuit boards Inspection Image scanners Assembled...

...William J. Hall; Paul T. Williams Purpose The authors aim to investigate the use of pyrolysis for the processing of waste printed circuit boards (PCBs). The aim was to make the process of separating the organic, metallic, and glass fibre fractions of PCBs much easier and therefore make recycling...

...K.H. Low; Yuqi Wang Purpose The paper aims to present a modeling method for multi‐layer, multi‐material printed circuit boards (PCBs) in both micro‐structure and board levels. Design/methodology/approach The method incorporates a multilayer finite element model that is established in two parts...

... μm, and therefore, a 150 μm larger pad diameter, is necessary for a theoretical mismatch of zero during the exposure of outer layers. Microprocessor chips Electrical components Circuit boards Mass production A technical solution would be to enlarge the contact area...

... customer application and the specific regional requirements. Originality/value The paper details how individual standards are applied to printed circuit boards and circuit board materials. It outlines the important considerations that have to be taken into account when supplying PCBs to European...

... assemblers to optimise their solder reflow conditions when assembling boards that require multiple solder cycles. © Emerald Group Publishing Limited 2006 Solders Circuit boards Soldering The use of immersion tin as a final finish for printed circuit boards has grown significantly in last...

...Narinder Bains; Kate Geraghty; Martin Goosey Purpose To present an update and the latest results from work on a project aimed at enabling printed circuit board (PCB) manufacturing to become more sustainable. Design/methodology/approach Various individual treatment technologies were studied...

... for base materials are given that will help to minimise the impact of these higher temperatures. Circuit boards Laminates Soldering From 1 July 2006, the RoHS Directive will not allow more than 0.1 per cent of lead by weight of homogeneous material, i.e. which cannot be mechanically...

... © MCB UP Limited 2002 --> Circuit boards Professional repair kit for repairing damaged circuit boards Keywords: Circuit boards The professional repairkit from Circuit Technology Center offers a "total package" for repairing damaged circuits, lands, surface mount...