...Happy T. Holden High density interconnect (HDI) printed circuits are now being designed in ever‐increasing quantities for very high‐speed applications. The challenge of opto‐electronics and integration of photonics into the printed circuit has started to take off. In the next 7 years, expectations...

... with finer and finer structures and high electrical performance. Printed circuit boards Interconnection The electronics industry is experiencing a demand for ever higher interconnect density and electrical performance. This trend has been particularly strong for flexible circuits used...

...Dougal Stewart Focuses on the development and capabilities of interconnect stress testing (IST), a stress testing method for printed circuit boards (PCBs) that is fast, repeatable and reproducible. IST technology was originally developed in the mid 1980s. Notes that using IST as an electrical test...

...Changqing Liu; David A. Hutt The solder interconnection of components to printed circuit boards normally utilises a flux to enable the efficient removal of oxide layers from the metals to be joined. While this produces a strong metallurgical bond, the flux residue left behind after the soldering...

...Udi Omer This paper gives a short introduction to the features of laser direct imaging (LDI) that make it a valuable technology for high density interconnect (HDI) manufacturing. Outlines the benefits and indicates that LDI is a viable, production proven solution for HDI imaging. As of today, CO...

...‐established imprinting process to provide a comparatively low cost and shorter route to the fabrication of high density interconnections and microvias. Imprint patterning is a new circuit formation process that is based on a well‐established technology called microreplication. Microreplication has been...

... 2002 Printed circuit boards Solder Interconnection Solid solder deposit (SSD) technology was developed in the early and mid‐1990s to improve first pass yields in the manufacture of electronic devices. As the trend towards finer pitch surface mount devices accelerated, an alternative...

... in their interconnection. Accompanying the reduction in feature sizes on IC chips has been an explosion in pin counts, especially in high‐end microprocessors. The challenge thus falls to the electronics interconnection and packaging industry to allow the pace to continue. Reviews strategies being either proposed or used...

... are turning to new manufacturing techniques and new materials in order to meet these demands from their customers. Sequential build‐up is one such technique and a plethora of new materials is available to support these innovative routes to high‐density interconnect circuitry. The basic concept involves...

...P.S.A. Evans; P.M. Harrey; B.J. Ramsey; D.J. Harrison Conductive lithographic films (CLF) are an emerging fabrication process for electronic interconnect and a range of passive component structures. This paper reviews the manufacture, properties and applications of CLF conductors, and discusses...

... © MCB UP Limited 2001 --> BPA Interconnection BPA to investigate optical backplanes Keywords: BPA, Interconnection As system performance pushes data rates up, designers are beginning to realise the opportunities provided by optical interconnect inside the system...

...Frank Coultard Keywords: PCIF, ICT, ADE, Interconnection "The wealth of any organisation is in the summation of its individuals". Some arrange the structures of their companies to encourage individual initiative and innovative, even radical thinking. Sadly the reverse is true also...

... © MCB UP Limited 1999 --> AlliedSignal Interconnection Electronics industry Business introduces advanced electronic substrate materials to serve emerging markets with enabling technologies for high-performance applications Keywords: AlliedSignal, Interconnection...

... in their interconnection. New methods such as build‐up multilayers and micro vias and co‐lamination of inner layers have been described and implemented by a number of different firms in an attempt to address this important issue. One such method employs simple double‐sided plated through hole flex circuits and the use...

...Joseph Fjelstad “A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers”. The balance of this brief article will hopefully serve to help the reader understand this remarkable interconnection technology and appreciate just how widely...

...T.J. Buck Increasing speeds combined with the level of integration that can be obtained with advanced IC technology has dramatically changed the interconnection requirements for high performance electronic systems. With much of today's circuitry being implemented in custom silicon, IC technology...

..., moulded and drilled. All combinations show excellent electrical stability; however, differences were found in mechanical behaviour between the various pin and hole combinations. Interconnections have not always been regarded as important in system design,However, this is changing due to digitisation...