...Mark W. Sugden; David A. Hutt; David C. Whalley; Changqing Liu Purpose The purpose of this paper is to present an outline of the development of a new process for the formation of flip‐chip interconnections using metal coated polymer microparticles. Design/methodology/approach Metal coated...

... an embedded polymer waveguide array in an electro‐OPCB. The lens receptacle formed a critical part of a dual lens pluggable in‐plane connection interface between peripheral optical devices and an OPCB. A lateral in‐plane mechanical accuracy of ±2 μm has been measured using this technique. Research...

... technology under development for the cost and resource efficient manufacture of flexible printed circuits (FPC). Design/methodology/approach The first two process steps of P³T include reel‐to‐reel patterned activation of polymer film at ambient pressure in the so‐called plasma‐printing process...

... at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners. Design/methodology/approach Several polymer waveguide fabrication...

... of laser processing to two specific material areas, namely thin films and nanocomposite films. The examples include BaTiO₃‐based thin films and BaTiO₃ polymer‐based nanocomposites. Findings A variety of new regular and random 3D surface patterns are highlighted. A frequency...

... of new techniques for metal deposition on non‐conducting or semiconducting substrates has emerged through the investigation of cross‐disciplinary routes ranging from organic metal‐complex chemistry, molecular self‐assembly, fluid dynamics, laser optics, photochemistry, thermodynamics or polymer science...

...Jean Rasmussen Purpose The purpose of this paper is to describe in detail the direct metallization of printed wiring boards using ENVISION^® HDI for the selective formation of intrinsic conductive polymer. Design/methodology/approach The process technology offers several advantages...

... Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its consortium of three universities and ten companies and to describe the university research being carried out. This paper briefly reviews the motivation for developing novel polymer formulations...

... docking and undocking of an active optical interface housed on a daughtercard to waveguides fabricated on an optical backplane. Findings The optical backplane connection system described has demonstrated its successful implementation with respect to optical data transfer across multimode polymer...

...Marika P. Immonen; Mikko Karppinen; Jorma K. Kivilahti Purpose To investigate the influences of environmental stresses on board‐embedded polymeric waveguides. Design/methodology/approach Optical multimode waveguides were embedded on printed circuit boards using commercial polymers. The optical...

...Gang Zou; Hans Grönqvist; Johan Liu Purpose To investigate the fabrication of integrated inductors on a liquid crystal polymer (LCP) substrate. To analyze the RF performance of the integrated inductors. Design/methodology/approach Fabrication of integrated inductors on a LCP substrate using...

... MCB UP Limited 1998 Environment Polymers Printed circuit boards Recycling Thick film The industry is increasingly confronted with the necessity of solving the problems associated with the disposal of discarded goods. The impact that products have on the environment is becoming...

..., circuit structures in printed circuit boards and probably also in moulded interconnection devices. The process uses — instead of copper and photoresists — layers of a special polymer poly(bis‐alkylthio‐acetylene),PATAC, in which leads or conducting organic structures will be written by laser‐induced local...