CS2 and EV Group reveal bumping technology relationship

CS2 and EV Group reveal bumping technology relationship

Keywords CS2, EV Group, Bumping, Packaging

EV Group (EVG), Austria and Custom Silicon Configuration Services (CS2),Belgium announced today that CS2 will install the EVG's EV640 Advanced Precision Aligner to increase CS2's bumping and packaging capabilities as well as reduce development time bringing CS2's new packages to market. By combining CS2's bumped array engineering expertise with EVG's advanced aligner technology European customers will have access to the very latest packages.

EVG's EV640 production Mask Aligner with automated alignment is the highest performance proximity aligner on the market today. Its multiple cassette robotic wafer handling software ensures the absolute highest through-put and quality,while guaranteeing minimum risk of substrate damage and still providing full flexibility for different wafer sizes and materials.