Issues

Appointments

Schoubert named International Service Manager for Quad

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Olympus' new subsidiary announces chief technology officer

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Datacon Semiconductor Equipment GmbH responds to rising demand from the USA, Asia and the Pacific Rim and appoints business manager

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Martin for top post

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CS2 announces new key account director

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Datacon Semiconductor Equipment GmbH appoints new European sales manager

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A novel approach for hybrid optoelectronic circuits: thick‐film on glass (TOG)

Achim Köhler; Peter Dullenkopf
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Effectiveness of conformal coatings on a PBGA subjected to unbiased high humidity, high temperature tests

Kang Zhang; Michael Pecht
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Assessing the cost‐effectiveness of integrated passives

Michael Scheffler; Gerhard Tröster; Joaquin Lopez Contreras; Jürgen Hartung; Michel Menard
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Investigation into the curing and thermal behavior of an epoxy‐based UV curable coating in microelectronics assembly

Chi Fo Tsang
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2D‐model for thermal analysis of hybrid power modules

B. Radojcoić; R. Ramović; O. Aleksić
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Exhibitions

Embedded systems – new sector at Electronica 2000

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IMAPS news

IMAPS UK

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"Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium

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IMAPS announces new officers for 2001

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IMAPS – Diary of events

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IMAPS Europe

Pavel Mach
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Industry news

Amkor technology announces factory expansion plans for the Philippines and Korea

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Du Pont provides its electronics customers with the "big screen" treatment

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Mintech and International Rectifier: new product line agreement

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Amkor completes acquisition of three semiconductor assembly factories

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Expanded microcircuit materials information now on www.dupont.com/mcm

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Du Pont focuses on information technologies

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GSI Lumonics receives multi-unit excimer laser sales order for manufacture of Fibre Bragg Gratings

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System-in-package prototype line opens at Amkor's Arizona facility

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Atmel and CS2 agree to develop interconnect technology for multi-element integration

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MRSI 505 opens eutectic die attach lab facility

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Long-term contract signed with AMS

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CS2 and EV Group reveal bumping technology relationship

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Amkor and RangeStar form partnership to place advanced antennas into module packages for wireless products

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Semiconductor manufacturers predict bright future for bare die

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CS2 establishes full service HF signal integrity lab

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Amkor expands IC test development capabilities; will acquire Integra Technologies

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Datacon continues to grow – preparations begin for second expansion within two years

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W.C. Heraeus acquires US-based PGP Industries

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W.C. Heraeus sells Heraeus Precision Engineering in Singapore to Jade Technologies Singapore

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AMKOR expands stacked chip-scale package capacity and 3D packaging family

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SEMATECH forges partnership with IMEC

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Joint development targets future photoresist and residue removal for low-K and copper

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CS2 breaks ground on second site – cleanroom capacity will more than triple

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Pasta and present

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Philips Semiconductors and TSMC announce new benchmark in lab construction

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Unitek Miyachi Corporation announces new corporate structure

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Bovis Lend Lease acquires Project Consultants Incorporated

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International diary

International diary

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Internet commentary

Or a rather tough worm in your little inside?

Brian Ellis
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New products

MicroJoin introduces new extended-length Ceramic Hot Bar Technology(TM) (CHBT(TM))

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BP Microsystems introduces high through-put Parallel Wafer Tester and Programmer, the BP-350

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New Vias in DBC

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PowerBGA 3.5 simplifies the design process by enabling engineers to manipulate die information

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Continuous web processing system unveiled by NanoVia, LP

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IMEC develops innovative fast-drying methods for single-wafer wet cleaning

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12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H

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New pressure indicating film is 50 per cent more accurate!

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IPL launch cost-competitive glass lid array

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Loctite introduces thermal shock resistant epoxy potting compound

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MicroJoin introduces the VTA 63 constant force weld head for low force high precision applications

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New automatic pulltester from F&K Delvotec

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Launch of new Micro-Screen

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Frequency shift tuning RF power generators enable ultra-thin film deposition in high-speed coating systems

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MRSI-505 combines flip chip bonding and delicate GaAs handling

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Seminars and training courses

Seminars and training courses

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