Atmel and CS2 agree to develop interconnect technology for multi-element integration

Atmel and CS2 agree to develop interconnect technology for multi-element integration

Keywords Atmel, CS2, Partnering, Interconnection, Thin film

Atmel Corporation and CS2 have announced the signature of a Memorandum of Understanding, creating a partnership for the development and implementation of an industry-leading thin-film interconnect technology for multi-element integration on a single substrate. This technology provides application developers with a single substrate supporting multiple die and integrated passive components giving significantly superior performance to previous-generation interconnect technologies. It has been validated at frequencies up to 50GHz.

Jean Vaylet, CEO of Atmel, Grenoble, emphasized the strategic importance of this agreement: "Atmel will now be able to integrate, for example, its state-of-the-art CMOS and SiGe dies on a single substrate, together with its established NVM and analog products. There is no need to wait for the development of a common process technology to give us integrated functionality on a single die – this interconnect technology gives us system-in-a-package capability today. It will add to our strength in all of our key markets:next-generation GSM, WAP, Bluetooth, wireless LAN, image acquisition and processing, and any emerging application that requires high-speed mixed-signal capability".

Atmel will provide a volume fabrication facility for this technology at its Grenoble installation, which will be equipped jointly by CS2 and Atmel. The plant will be able to integrate die from Atmel as well as third parties, with capacity shared equally between Atmel and CS2.

Demonstration products are anticipated during the first quarter, 2001.