IMAPS Plans IMAPS-ISRAEL 2002 Conference
IMAPS has announced The 3rd International Conference on Microelectronics Packaging, IMAPS-ISRAEL 2002. This conference will be held at the Daniel Hotel,Herzelia – On – Sea, Israel, June 13, 2002. The technical committee has issued a Call for Papers, and seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. It is sponsored by The International Microelectronics and Packaging Society (IMAPS) Israeli Chapter.
General Chair is Uri Barneah; e-mail:Ubarneah@inter.net.il;Technical program Chair is Jacob Hormadaly, e-mail: Hormadj@bgumail.bgu.ac.il; and Technical Program Committee, Haim Shalav, e-mail mailto;Haimsh@rafael.co.il.
Issues covered at the conference will include Active Devices (Detectors,Sensors, MEMs, Optoelectronics, Superconductors; Ball Grid Array Packages, Chip Scale Packages, Design, Modeling, Simulation (Reliability,Thermal Management)Emerging Technologies, Interconnects, Bonding (Flip Chip, Wire Bonding),Sensors, Actuators, MEMS, Surface Mount Technology, Thick Film Materials, Thin Film Materials, Wireless Packaging, and more.
