Issues

Appointments

Radiant technology corporation names new marketing head

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New man at the helm for X-Tek

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Integrated Photomatrix announces new MD to take the helm

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Rapid production of microwave packaging in silicon–aluminium by thin‐shell electroforming

C. Bocking; D.M. Jacobson; A.E.W. Rennie
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Observations on the characteristics of thick film k33 strain sensors fabricated on steel substratesThis paper is based on a poster presentation made at the IMAPS 2001 Symposium, Baltimore.

Yulan Zheng; John Atkinson; Zhige Zhang; Russ Sion
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N‐channel power MOSFET for fast neutron detection

C. Salame; P. Mialhe; J.‐P. Charles; A. Khoury
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The investigation of the capillary flow of underfill materials

C.Y. Huang
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On the frequency‐dependent line capacitance and conductance of on‐chip interconnects on lossy silicon substrate

H. Ymeri; B. Nauwelaers; K. Maex
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Editorial

Editorial

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Exhibitions/seminars

A range of new chemicals

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FiberComm - new European platform for optical information and communications technology

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IMAPS news

Advanced Technology Workshop on Passive Integration

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IMAPS Europe – Cracow

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MicroTech 2002 Programme

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Dr. Peter Barnwell New 2002 IMAPS President-elect

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IMAPS Announces New Executive Council Members

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Pan Pacific Microelectronics Symposium Preliminary Program Announced

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IMAPS-UK AGM 17:30 in the Stanley Suite

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IMAPS Plans IMAPS-ISRAEL 2002 Conference

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Industry news

Bell Labs scientists create high-temperature organic superconductor

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CoorsTek lays off about 300 workers and posts a net loss

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IMEC opens business development office in China

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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New products

New flip chip underfill offers high compatibility with no-clean fluxes

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In-situ UV cure automates assembly of optoelectronic packages

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New system offers zero-stress coatings in MEMS and nano-fabrication

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BTUS new Pyramax reflow systems lowers cost of ownership

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Semiconductor characterization software provides simultaneous HF and quasistatic C-V measurements

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New convertible head flip chip bonder

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MRSI introduces micro-stamping with automatic tool changer

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Professional imaging with the new compact digital camera 0P12 from Olympus

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IC-SCAN DE tracks MSDs for double side reflow boards

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Note from the publisher

How to get the best from your Emerald subscription

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Publications

Photonic packaging – exciting opportunities in difficult times

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