2003 Conference on Ceramic Interconnect Technology announced
Keywords: IMAPS, Ceramics interconnectic
IMAPS, The Ceramic Interconnect Initiative and the American Ceramic Society are pleased to announce the 2003 Conference on Ceramic Interconnect Technology,to be held at the Westin Hotel, Denver, Colorado, USA, April 8-9, 2003.
This Conference will identify and address key issues in packaging in ceramic interconnect technology, which is finding wide application in many new and rapidly growing microwave wireless and photonics applications. This workshop will cover the most recent advancements in ceramic interconnect technology materials and process for these applications, essential in reducing time to market, reducing costs, and wide-scale deployment of these rapidly growing technologies.
Papers are invited for proposed session on the following topics; abstracts are due by November 15, 2002, and can be submitted online at www.imaps.org:
Portable wireless applications and Bluetooth
Base stations
Broadband and mm wave
Military applications
Fiber Optic and Electro-Optic applications
Automotive Applications
MEMS Applications
Materials
Integrated Passives
Design, modeling and simulation
Testing
Thermal Properties
Assembly
