IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference

IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference

Keywords: IMAPS, Ceramics

IMAPS and the Ceramic Interconnect Initiative (CII) has announced the “Ceramic Interconnect Technology: The Next Generation” Conference, scheduled for 8-9 April, 2003 at the Westin Hotel in Denver, Colorado, USA.

Sponsored by IMAPS and the CII, and endorsed by the American Ceramic Society,this expanded 2003 Conference on Ceramic Interconnect Technology will explore leading-edge issues in ceramic interconnect technology, which has a long history of meeting the requirements of the most demanding applications.

The organizing chairs have selected a world wide panel of industry experts to chair sessions for this Conference (see Table I).

In addition, keynote speakers are expected to review technology and applications in areas of high interest, including embedded passives, automotive,microfluidics and MEMS.

Table I World wide panel of industry experts and their planned sessions