IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference
IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference
Keywords: IMAPS, Ceramics
IMAPS and the Ceramic Interconnect Initiative (CII) has announced the “Ceramic Interconnect Technology: The Next Generation” Conference, scheduled for 8-9 April, 2003 at the Westin Hotel in Denver, Colorado, USA.
Sponsored by IMAPS and the CII, and endorsed by the American Ceramic Society,this expanded 2003 Conference on Ceramic Interconnect Technology will explore leading-edge issues in ceramic interconnect technology, which has a long history of meeting the requirements of the most demanding applications.
The organizing chairs have selected a world wide panel of industry experts to chair sessions for this Conference (see Table I).
In addition, keynote speakers are expected to review technology and applications in areas of high interest, including embedded passives, automotive,microfluidics and MEMS.
| Design, simulation and modeling | John Gipprich | Northrop Grumman |
| Power and thermal management | Dr. Kinzy Jones | Florida International University |
| Portable wireless and bluetooth | Dr. Fred Barlow | University of Arkansas |
| Broadband | Dr. Jens Mueller | University of Erlangen |
| Fiber optic and electrooptic | Dr. Alan Lyons | Lucent Corp. |
| LTCC | Dr. Mike Lanagan | Penn State University |
| Materials | Dan Amey | DuPont Electronic Technologies |
| Automotive | Dr. D. H. Sarma | Delphi Automotive |
| Integrated passives | Dr. William Borland | DuPont Electronic Technologies |
| Testing and measurement | Mike Janizec | NIST |
| Assembly | Paul Collander | NOKIA |
| Base stations | George Passiopoulos | NOKIA |
| Military | John Roman | Consultant |
| Novel applications | Steve Dai | Motorola |
| Ceramic inteconnect markets | Rick Sigliano | Kyocera Americas |
| Design, simulation and modeling | John Gipprich | Northrop Grumman |
| Power and thermal management | Dr. Kinzy Jones | Florida International University |
| Portable wireless and bluetooth | Dr. Fred Barlow | University of Arkansas |
| Broadband | Dr. Jens Mueller | University of Erlangen |
| Fiber optic and electrooptic | Dr. Alan Lyons | Lucent Corp. |
| LTCC | Dr. Mike Lanagan | Penn State University |
| Materials | Dan Amey | DuPont Electronic Technologies |
| Automotive | Dr. D. H. Sarma | Delphi Automotive |
| Integrated passives | Dr. William Borland | DuPont Electronic Technologies |
| Testing and measurement | Mike Janizec | NIST |
| Assembly | Paul Collander | NOKIA |
| Base stations | George Passiopoulos | NOKIA |
| Military | John Roman | Consultant |
| Novel applications | Steve Dai | Motorola |
| Ceramic inteconnect markets | Rick Sigliano | Kyocera Americas |
Table I World wide panel of industry experts and their planned sessions
