Fabrication of High Density Multi‐chip Modules with Standard IC Production Equipment

Since the first appearance of high density interconnection systems about ten years ago, researchers have tried to exploit this concept to the full. By introducing new technologies and materials, they have succeeded in building a module that equals wafer scale integration (WSI) in speed and efficiency. However, MCMs have not yet experienced rapid growth and acceptance as a result of the large capital investment and rather small volumes involved. This paper sets out to show that MCMs can be fabricated using technology and processes already in existence at most conventional IC and thin‐film production facilities.