Low temperature cofired ceramics(LTCCs) combine the advantages of both multilayer substrates with excellent high‐frequency properties and a high‐conductivity metallisation. The possibility to realise passive components embedded in the glass ceramics increases the scale of integration. Inductors are designed as single‐layer (planar spiral) or multilayer (3D) arrangements of narrow conductive traces with useful values up to a few hundred nanohenry. This range makes them useful for high‐frequency applications. Although the conductor pastes used have a low resistance, the maximum quality factor of these coils seldom exceeds 60. The decisive parameter in this regard is the line thickness which is normally 10–15 μm. A novel technique based on laser scribed canals permits conductor patterns with an almost square cross‐section, thus reducing the line resistance by a factor up to 10. Coils manufactured by this method have a considerably improved quality and are able to withstand high currents. This property widens the range of applications for LTCCs into the field of high‐power electronics.
Article navigation
1 August 1997
Research Article|
August 01 1997
High‐quality RF Inductors in LTCC
J. Müller
J. Müller
Technical University of Ilmenau, Department of Electrical Engineering,Microperipheric Group, Ilmenau,Germany
Search for other works by this author on:
Publisher: Emerald Publishing
Online ISSN: 1758-812X
Print ISSN: 1356-5362
© MCB UP Limited
1997
Microelectronics International (1997) 14 (2): 59–63.
Citation
Müller J (1997), "High‐quality RF Inductors in LTCC". Microelectronics International, Vol. 14 No. 2 pp. 59–63, doi: https://doi.org/10.1108/13565369710800501
Download citation file:
New and popular articles
Suggested Reading
Planarisation of NiFe2O4 Thick Film Ferrite Inductors
Microelectronics International (August,1997)
Advanced Thick‐film Technology — The New Generation
Microelectronics International (December,1997)
A Zero X‐Y Shrinkage Low Temperature Cofired Ceramic Substrate Using Ag and AgPd Conductors for Flip‐chip Bonding*
Microelectronics International (December,1997)
Article comprising an inductor
Assembly Automation (March,2002)
Thermal & mechanical simulation and experiments in micro-electronics and micro-systems
Microelectronics International (December,2002)
Related Chapters
Impact of the COVID-19 Pandemic on the Electronic Industry in Russia
Current Problems of the World Economy and International Trade
Recommended for you
These recommendations are informed by your reading behaviors and indicated interests.
