Issues

Interconnection Technology for Advanced High Density Thick Films

M. Vrana; A. Van Calster; R. Vanden Berghe**; K. Allaert
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Fine‐line Passive Components for Hybrid Microelectronics

V. Kripesh; S.K. Bhatnagar; H. Osterwinter; W. Gust
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Application of Taguchi Methods to the Production of Integrated Circuits

I.E. Klein
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An Ultra High Density Technology for Microsystems

S. Larcombe; P. Ivey
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Advances in Packaging and Assembly Polymers

K. Gilleo
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Packaging Reliability for High Temperature Electronics: A Materials Focus

F.P. McCluskey; L. Condra; T. Torri; J. Fink
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Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices

R. Cross
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Spin Coating Study for Thick Layers with High Viscosity Polyimide

M. Borsetto; G. Carcano; M. Ceriani
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