Issues

Appointments

Exsil announces new president

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Matthew Wilson joins MRSI product applications staff

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Lane to Menvier

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Leo van Bree appointed vice president and general manager for Schlumberger Semiconductor Solutions, Europe

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Lisa Michael joins semiconbay.com

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Vitronics Soltec names new president, sales director for North and South America

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Air Products appoints new president of electronic chemicals

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Book Review

An Engineer’s Handbook of Encapsulation and Underfill Technology

David Kingsley
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Conductive Adhesives for Electronics Packaging

Nihal Sinnadurai
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Assembly issues in three flip chip processes

Zhaowei Zhong
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Packaging of closed chamber PCR‐chips for DNA amplification

C.G.J. Schabmueller; A.G.R. Evans; A. Brunnschweiler; G. Ensell; D.L. Leslie; M.A. Lee
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Embedded passive components and PCB size – thermal effects

D.M. Stubbs; S.H. Pulko; A.J. Wilkinson; B. Wilson; F. Christiaens; K. Allaert
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Wafer level packaging of compliant, chip size ICs

Joseph Fjelstad; Thomas DiStefano; Anthony Faraci
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Advances in microwave MCM‐D technology

Philip Pieters; Walter De Raedt; Eric Beyne
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Conferences/exhibitions

Announcing the 3rd Annual IMAPS-UK/IEEE-CPMT/ASME/SPE/SPIE/MRS Workshop (POLY 2000)

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Boston's Hynes Convention Center is site for International Microelectronics and Packaging Society (IMAPS) Year 2000 Annual Symposium

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IMAPS news

MicroTech 2001

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IMAPS Israel

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IMAPS Nordic

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IMAPS UK

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Industry news

Technologists from around the world converge in semiconbay.com Webcast

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Racal strengthens position with Inotek purchase

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Dow Corning and Air Products join forces to supply trimethylsilane to the global semiconductor industry

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Launch of Microelectronics Europe (SME)

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NPL to generate data on underfills

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Protonique has moved

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Kulicke & Soffa and DATACON establish joint European Technology Center

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semiconbay.com enters into agreement with SBN and The Electrochemical Society

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Amkor to install wafer bumping capability to support growing demand for flip chip packaging

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Technology news from Philips Semiconductors

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Loctite acquires multicore solders

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Dage moves into Japan

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Kulicke & Soffa and Amkor Technology announce flip chip technologies license

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Menvier Hybrids closes the gap

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Mintech raises wafer stakes

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Study reveals the future of bare die

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Amkor and Unitive Electronics sign licensing agreement for new flip chip wafer bumping technology ideal for communications

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New Leica Microsystems training centre - an offer for the worldwide semiconductor industry

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CMP provides ARM® solutions to academic institutions

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Cammax is first in UK with in-house die bonding processing service

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Project proposal: Bluetooth application group

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International diary

International diary

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New products

Automated acoustic imaging of board-mounted components

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Speedier backside silicon thinning for emission imaging

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Suss implements breakthrough contact printing technology

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Wide range of microwave ferrites and dielectrics launched by Frequency Products

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Unitive introduces low alpha count flip chip wafer bumping

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MRSI introduces advanced technology for eutectic die attach

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SEC introduces motorized image sweeping, rotating die collet on bonders

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Mini-Systems resistors qualify for Life Failure Rate R

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3D laser inspection system for bump inspection

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Super FSF-52 thermal interface material

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Philips Semiconductors announces a new methodology for designing next-generation silicon system chips

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SEC develops work chucks for high temperature bonding

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New Mini-Systems program provides real-time data on similar products

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Suss launches new high end production flip chip bonder

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New high density RF plasma source reduces contaminants to produce higher quality thin films

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SEC designs rapid heat head for flip chip bonders

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Web sites

Microtek Labs launches new Web site for UL testing, adds e-commerce to facilitate easy customer registration

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SEC expands Web site

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