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Thick and thin film microstripline properties due to polyaniline thin film overlay

B.B. Vhanakhande; S.V. Jadhav; Vijaya Puri
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Silicon MOSFET devices electrical parameters evolution at high temperatures

C. Salame; R. Habchi
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Edge direct tunneling current in nano‐scale MOSFET with high‐K dielectrics

Jian‐hong Yang; Gui‐fang Li; Hui‐lan Liu
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Wire bond challenges in low‐k devices

Srikanth Narasimalu
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Electromagnetic band‐gap (EBG) structures using combined inductive and capacitive elements and chirping‐and‐tapering technique

Ming‐Sze Tong; Tae‐Gyu Chang; Ronan Sauleau
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Effects of scaling on the impact ionization and sub‐threshold current in submicron MOSFETs

Bhavana Jharia; S. Sarkar; R.P. Agarwal
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XPS and AFM investigations on silver‐based photoimageable thick film systems

Govind Umarji; Supriya Ketkar; Ranjit Hawaldar; Suresh Gosavi; Kashinath Patil; Uttam Mulik; Dinesh Amalnerkar
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Low‐power wireless smart data acquisition system for monitoring pressure in medical application

K. Arshak; A. Arshak; E. Jafer; D. Waldern; J. Harris
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Industry news

IPC market research studies on strategies for global expansion and microelectronics

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Agreement between Laird Technologies and ITEQ Corporation provides unique solution for flat panel display market

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Surrey Nanosystems wins order for advanced sputtering tool from poland's Institute of Electron Technology

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The new challenge of M2M:putting the pieces together for total information convergence

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ASTM declarable substances subcommittee developing proposed tin-based solder alloys standard

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International diary

International diary

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New appointments

New appointments at the Edinburgh International Science Festival

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Emerald ex-editor honoured by UN and USA

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New products

SAW components: smallest duplexer for WCDMA Band VIII

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Miniature Rogowski probes upgraded for power electronics market

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Custom gold and silver plating for high-performance waveguides

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LSI APP3300 advanced communication processor offers new levels of real-time service delivery for next-generation access networks

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Avago Technologies introduces ultra-compact input device with multi-mode linear and 2D navigation for handheld, and ultra-miniature PC applications

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Fairchild Semiconductor's IntelliMAX™ series in space-efficient, 2 x 2mm green MLP package provides 45 per cent improved thermal dissipation in portables

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Software upgrade from Zensys

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New RoHS-compliant programmable headers and covers by Aries Electronics eliminate the need for DIP switches

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HUBER +SUHNER launches SC-RJ IP67 Fibre Optic assemblies for harsh environments

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Rugged LCD touch screens for embedded applications

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Adapt, adopt, improve – Thinky at Deutsch

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New range of linked LEDs

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Pickering Interfaces introduces new LXI optical switching solution

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QuickLogic adds a high-speed SPI Host Controller option into its CSSP library

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